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1. general description the 74lvc1g126 provides one non-inverting buffer/line driver with 3-state output. the 3-state output is controlled by the output enable input (oe). a low-level at pin oe causes the output to assume a high-impedance off-state. the input can be driven from either 3.3 v or 5 v devices. this feature allows the use of this device in a mixed 3.3 v and 5 v environment. this device is fully speci?ed for partial power-down applications using i off . the i off circuitry disables the output, preventing the damaging back?ow current through the device when it is powered down. 2. features n wide supply voltage range from 1.65 v to 5.5 v n high noise immunity n complies with jedec standard: u jesd8-7 (1.65 v to 1.95 v) u jesd8-5 (2.3 v to 2.7 v) u jesd8b/jesd36 (2.7 v to 3.6 v) n 24 ma output drive (v cc = 3.0 v) n cmos low power consumption n latch-up performance exceeds 250 ma n direct interface with ttl levels n inputs accept voltages up to 5 v n multiple package options n esd protection: u hbm jesd22-a114e exceeds 2000 v u mm jesd22-a115-a exceeds 200 v n speci?ed from - 40 cto+85 c and - 40 c to +125 c 74lvc1g126 bus buffer/line driver; 3-state rev. 08 9 april 2009 product data sheet
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 2 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 3. ordering information 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. functional diagram table 1. ordering information type number package temperature range name description version 74lvc1g126gw - 40 c to +125 c tssop5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 74lvc1g126gv - 40 c to +125 c sc-74a plastic surface-mounted package; 5 leads sot753 74lvc1g126gm - 40 c to +125 c xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1.45 0.5 mm sot886 74lvc1g126gf - 40 c to +125 c xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1 0.5 mm sot891 table 2. marking codes type number marking [1] 74lvc1g126gw vn 74lvc1g126gv v26 74lvc1g126gm vn 74lvc1g126gf vn fig 1. logic symbol fig 2. iec logic symbol fig 3. logic diagram mna125 a oe y 2 1 4 mna126 1 4 oe 2 mna127 oe a y
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 3 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 6. pinning information 6.1 pinning 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; x = dont care; z = high-impedance off-state. fig 4. pin con?guration sot353-1 and sot753 fig 5. pin con?guration sot886 fig 6. pin con?guration sot891 74lvc1g126 oe v cc a gnd y 001aaf196 1 2 3 5 4 74lvc1g126 a 001aaf197 oe gnd n.c. v cc y transparent top view 2 3 1 5 4 6 74lvc1g126 a 001aaf401 oe gnd n.c. v cc y transparent top view 2 3 1 5 4 6 table 3. pin description symbol pin description sot353-1/sot753 sot886/sot891 oe 1 1 output enable input a 2 2 data input gnd 3 3 ground (0 v) y 4 4 data output n.c. - 5 not connected v cc 5 6 supply voltage table 4. function table [1] input output oe a y hl l hhh lxz
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 4 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 8. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] when v cc = 0 v (power-down mode), the output voltage can be 5.5 v in normal operation. [3] for tssop5 and sc-74a packages: above 87.5 c the value of p tot derates linearly with 4.0 mw/k. for xson6 package: above 118 c the value of p tot derates linearly with 7.8 mw/k. 9. recommended operating conditions table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +6.5 v i ik input clamping current v i < 0 v - 50 - ma v i input voltage [1] - 0.5 +6.5 v i ok output clamping current v o > v cc or v o < 0 v - 50 ma v o output voltage active mode [1] [2] - 0.5 v cc + 0.5 v power-down mode [1] [2] - 0.5 +6.5 v i o output current v o = 0 v to v cc - 50 ma i cc supply current - 100 ma i gnd ground current - 100 - ma p tot total power dissipation t amb = - 40 c to +125 c [3] - 250 mw t stg storage temperature - 65 +150 c table 6. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 1.65 - 5.5 v v i input voltage 0 - 5.5 v v o output voltage active mode 0 - v cc v v cc = 0 v; power-down mode 0 - 5.5 v t amb ambient temperature - 40 - +125 c d t/ d v input transition rise and fall rate v cc = 1.65 v to 2.7 v - - 20 ns/v v cc = 2.7 v to 5.5 v - - 10 ns/v
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 5 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 10. static characteristics table 7. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ [1] max unit t amb = - 40 c to +85 c v ih high-level input voltage v cc = 1.65 v to 1.95 v 0.65 v cc -- v v cc = 2.3 v to 2.7 v 1.7 - - v v cc = 2.7 v to 3.6 v 2.0 - - v v cc = 4.5 v to 5.5 v 0.7 v cc -- v v il low-level input voltage v cc = 1.65 v to 1.95 v - - 0.35 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 2.7 v to 3.6 v - - 0.8 v v cc = 4.5 v to 5.5 v - - 0.3 v cc v v ol low-level output voltage v i =v ih or v il v cc = 1.65 v to 5.5 v; i o = 100 m a - - 0.1 v v cc = 1.65 v; i o = 4 ma - - 0.45 v v cc = 2.3 v; i o = 8 ma - - 0.3 v v cc = 2.7 v; i o = 12 ma - - 0.4 v v cc = 3.0 v; i o = 24 ma - - 0.55 v v cc = 4.5 v; i o = 32 ma - - 0.55 v v oh high-level output voltage v i =v ih or v il v cc = 1.65 v to 5.5 v; i o = - 100 m av cc - 0.1 - - v v cc = 1.65 v; i o = - 4 ma 1.2 - - v v cc = 2.3 v; i o = - 8 ma 1.9 - - v v cc = 2.7 v; i o = - 12 ma 2.2 - - v v cc = 3.0 v; i o = - 24 ma 2.7 - - v v cc = 4.5 v; i o = - 32 ma 3.8 - - v i i input leakage current v cc = 0 v to 5.5 v; v i = 5.5 v or gnd - 0.1 5 m a i oz off-state output current v cc = 3.6 v; v i = v ih or v il ; v o = 5.5 v or gnd - 0.1 10 m a i off power-off leakage current v cc = 0 v; v i or v o = 5.5 v - 0.1 10 m a i cc supply current v i = 5.5 v or gnd; v cc = 1.65 v to 5.5 v; i o =0a - 0.1 10 m a d i cc additional supply current per pin; v cc = 2.3 v to 5.5 v; v i =v cc - 0.6 v; i o = 0 a - 5 500 m a c i input capacitance - 5 - pf
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 6 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state [1] all typical values are measured at v cc = 3.3 v and t amb =25 c. t amb = - 40 c to +125 c v ih high-level input voltage v cc = 1.65 v to 1.95 v 0.65 v cc -- v v cc = 2.3 v to 2.7 v 1.7 - - v v cc = 2.7 v to 3.6 v 2.0 - - v v cc = 4.5 v to 5.5 v 0.7 v cc -- v v il low-level input voltage v cc = 1.65 v to 1.95 v - - 0.35 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 2.7 v to 3.6 v - - 0.8 v v cc = 4.5 v to 5.5 v - - 0.3 v cc v v ol low-level output voltage v i =v ih or v il v cc = 1.65 v to 5.5 v; i o = 100 m a - - 0.1 v v cc = 1.65 v; i o = 4 ma - - 0.70 v v cc = 2.3 v; i o = 8 ma - - 0.45 v v cc = 2.7 v; i o = 12 ma - - 0.60 v v cc = 3.0 v; i o = 24 ma - - 0.80 v v cc = 4.5 v; i o = 32 ma - - 0.80 v v oh high-level output voltage v i =v ih or v il v cc = 1.65 v to 5.5 v; i o = - 100 m av cc - 0.1 - - v v cc = 1.65 v; i o = - 4 ma 0.95 - - v v cc = 2.3 v; i o = - 8 ma 1.7 - - v v cc = 2.7 v; i o = - 12 ma 1.9 - - v v cc = 3.0 v; i o = - 24 ma 2.0 - - v v cc = 4.5 v; i o = - 32 ma 3.4 - - v i i input leakage current v cc = 0 v to 5.5 v; v i = 5.5 v or gnd - - 100 m a i oz off-state output current v cc = 3.6 v; v i = v ih or v il ; v o = 5.5 v or gnd -- 200 m a i off power-off leakage current v cc = 0 v; v i or v o = 5.5 v - - 200 m a i cc supply current v i = 5.5 v or gnd; v cc = 1.65 v to 5.5 v; i o =0a - - 200 m a d i cc additional supply current per pin; v cc = 2.3 v to 5.5 v; v i =v cc - 0.6 v; i o = 0 a - - 5000 m a table 7. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ [1] max unit
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 7 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 11. dynamic characteristics [1] typical values are measured at t amb =25 c and v cc = 1.8 v, 2.5 v, 2.7 v, 3.3 v and 5.0 v respectively. [2] t pd is the same as t plh and t phl [3] t en is the same as t pzh and t pzl [4] t dis is the same as t plz and t phz [5] c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ ? (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l v cc 2 f o ) = sum of outputs. table 8. dynamic characteristics voltages are referenced to gnd (groun d = 0 v). for test circuit see figure 9 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max t pd propagation delay a to y; see figure 7 [2] v cc = 1.65 v to 1.95 v 1.0 3 8.0 1.0 10.5 ns v cc = 2.3 v to 2.7 v 0.5 2.1 5.5 0.5 7 ns v cc = 2.7 v 0.5 2.3 5.5 0.5 7 ns v cc = 3.0 v to 3.6 v 0.5 2.0 4.5 0.5 6 ns v cc = 4.5 v to 5.5 v 0.5 1.7 4.0 0.5 5.5 ns t en enable time oe to y; see figure 8 [3] v cc = 1.65 v to 1.95 v 1.0 3.2 9.4 1.0 12 ns v cc = 2.3 v to 2.7 v 0.5 2.2 6.6 0.5 8.5 ns v cc = 2.7 v 0.5 2.4 6.6 0.5 8.5 ns v cc = 3.0 v to 3.6 v 0.5 2.1 5.3 0.5 7 ns v cc = 4.5 v to 5.5 v 0.5 1.6 5.0 0.5 6.5 ns t dis disable time oe to y; see figure 8 [4] v cc = 1.65 v to 1.95 v 1.0 4.3 9.2 1.0 12 ns v cc = 2.3 v to 2.7 v 0.5 2.7 5.5 0.5 7 ns v cc = 2.7 v 0.5 3.4 5.5 0.5 7 ns v cc = 3.0 v to 3.6 v 0.5 3.0 5.5 0.5 7 ns v cc = 4.5 v to 5.5 v 0.5 2.2 4.2 0.5 5.5 ns c pd power dissipation capacitance per buffer; v i = gnd to v cc [5] output enabled - 25 - - - pf output disabled - 6 - - - pf
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 8 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 12. waveforms measurement points are given in t ab le 9 . v ol and v oh are typical output voltage levels that occur with the output load. fig 7. input a to output y propagation delay times mna128 a input y output t phl t plh gnd v i v m (1) v m (1) measurement points are given in t ab le 9 . v ol and v oh are typical output voltage levels that occur with the output load. fig 8. 3-state enable and disable times mna646 t plz t phz output disabled output enabled v y v x output enabled output low-to-off off-to-low output high-to-off off-to-high oe input v i v cc v ol v oh v m gnd gnd t pzl t pzh v m v m table 9. measurement points supply voltage input output v cc v m v m v x v y 1.65 v to 1.95 v 0.5v cc 0.5v cc v ol + 0.15 v v oh - 0.15 v 2.3 v to 2.7 v 0.5v cc 0.5v cc v ol + 0.15 v v oh - 0.15 v 2.7 v 1.5 v 1.5 v v ol + 0.3 v v oh - 0.3 v 3.0 v to 3.6 v 1.5 v 1.5 v v ol + 0.3 v v oh - 0.3 v 4.5 v to 5.5 v 0.5v cc 0.5v cc v ol + 0.3 v v oh - 0.3 v
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 9 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state test data is given in t ab le 10 . de?nitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 9. load circuitry for switching times v ext v cc v i v o mna616 dut c l r t r l r l g table 10. test data supply voltage input load v ext v cc v i t r , t f c l r l t plh , t phl t pzh , t phz t pzl , t plz 1.65 v to 1.95 v v cc 2.0 ns 30 pf 1 k w open gnd 2v cc 2.3 v to 2.7 v v cc 2.0 ns 30 pf 500 w open gnd 2v cc 2.7 v 2.7 v 2.5 ns 50 pf 500 w open gnd 6 v 3.0 v to 3.6 v 2.7 v 2.5 ns 50 pf 500 w open gnd 6 v 4.5 v to 5.5 v v cc 2.5 ns 50 pf 500 w open gnd 2v cc
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 10 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 13. package outline fig 10. package outline sot353-1 (tssop5) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (1) z (1) q references outline version european projection issue date iec jedec jeita mm 0.1 0 1.0 0.8 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 e 1 1.3 2.25 2.0 0.60 0.15 7 0 0.1 0.1 0.3 0.425 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.46 0.21 sot353-1 mo-203 sc-88a 00-09-01 03-02-19 w m b p d z e e 1 0.15 13 5 4 q a a 2 a 1 l p (a 3 ) detail x l h e e c v m a x a y 1.5 3 mm 0 scale tssop5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 1.1
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 11 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state fig 11. package outline sot753 (sc-74a) references outline version european projection issue date iec jedec jeita sot753 sc-74a wb m b p d e a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 plastic surface-mounted package; 5 leads sot753 unit a 1 b p cd e h e l p qy w v mm 0.100 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 02-04-16 06-03-16
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 12 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state fig 12. package outline sot886 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot886 mo-252 sot886 04-07-15 04-07-22 dimensions (mm are the original dimensions) xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 1.5 1.4 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.5 0.6 a (1) max 0.5 0.04 1 6 2 5 3 4 6 (2) 4 (2) a
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 13 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state fig 13. package outline sot891 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot891 sot891 05-04-06 07-05-15 xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale dimensions (mm are the original dimensions) unit mm 0.20 0.12 1.05 0.95 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.35 0.55 a max 0.5 0.04 1 6 2 5 3 4 a 6 (1) 4 (1) note 1. can be visible in some manufacturing processes.
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 14 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 14. abbreviations 15. revision history table 11. abbreviations acronym description cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 12. revision history document id release date data sheet status change notice supersedes 74lvc1g126_8 20090409 product data sheet - 74lvc1g126_7 modi?cations: t ab le 2 : table note added, explaining where to ?nd the pin 1 indicator. 74lvc1g126_7 20070830 product data sheet - 74lvc1g126_6 74lvc1g126_6 20061009 product data sheet - 74lvc1g126_5 74lvc1g126_5 20040921 product speci?cation - 74lvc1g126_4 74lvc1g126_4 20021002 product speci?cation - 74lvc1g126_3 74lvc1g126_3 20020528 product speci?cation - 74lvc1g126_2 74lvc1g126_2 20010406 preliminary speci?cation - 74lvc1g126_1 74lvc1g126_1 20001222 preliminary speci?cation - -
74lvc1g126_8 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 08 9 april 2009 15 of 16 nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74lvc1g126 bus buffer/line driver; 3-state ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 9 april 2009 document identifier: 74lvc1g126_8 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 17 contact information. . . . . . . . . . . . . . . . . . . . . 15 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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